wire bonding
英 [ˈwaɪə(r) ˈbɒndɪŋ]
美 [ˈwaɪər ˈbɑːndɪŋ]
网络 打线; 焊线; 引线接合法; 引线键合; 打线接合
双语例句
- Considering these factors, the flowing two parts should be considered in the wire bonding process: Free air ball formation and Looping stability.
对应于这些参数在焊线机制程的关键技术，可分为金线结球及焊线路径稳定性两个部分。 - Design of High-frequency Ultrasonic Transducer for Wire Bonding and Research on Motion Control of Bond Head
引线键合高频超声换能器的设计和键合头运动控制研究 - Another focus was on how the operating parameters affect the ultrasonic wire bonding.
分析了各工作参数对超声波线焊产生的影响。 - Metal wire bonding interconnection is the key means in the internal matching technology of RF power transistor.
金属键合线互连是射频大功率晶体管内匹配技术中的关键手段。 - Evaluation of Bondability and Reliability of Single Crystal Copper Wire Bonding in Semiconductor Packaging; transistor-transistor logic
单晶铜丝在半导体器件封装中的打线键合性能研究晶体管-晶体管逻辑电路 - The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is stated.
纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。 - Taguchi method; Soft algorithms; Wire bonding process.
田口方法；柔性演算法；焊线制程。 - Wafer chip scale packaging ( WCSP) eliminates conventional packaging steps such as die bonding, wire bonding, and die level flip chip attach processes.
晶圆级芯片尺寸封装（WCSP）消除了类似传统的芯片键合、引线键合和倒装芯片贴装过程的封装工序。 - To improve the speed and accuracy of automatic frequency tracking on thermosonic wire bonding, the design scheme based on FPGA was proposed.
为进一步提高热超声引线键合超声电源的自动频率跟踪速度及精度，提出了基于现场可编程门阵列（FPGA）的超声电源设计方案。 - Research of Ultrasonic Power Supply in Wire Bonding Based on FPGA
基于FPGA的引线键合超声电源的研究 - In ultrasonic wire bonding process, the bonding pressure is one of the most important factors to the bonding strength.
在超声引线键合过程中，键合压力是影响键合强度的重要因素之一。 - Simulation and Study of Ultrasonic Vibration Propagation in Wire Bonding System
超声振动在引线键合系统中的传播仿真与研究 - Design of welding pressure control system for ultrasonic gold wire bonding machine
超声波金丝球焊线机焊接压力控制系统设计 - Wire bonding is the most classical and most mature technique for IC interconnection, which takes most of the market share, there are also a lot of research on ultra-fine-pitch wire interconnection must to do.
摘要引线键合是应用时间最长、技术最为成熟且目前市场有率最高的芯片连接技术，但应用于超细间距引线互连还有许多技术有待研究。 - Twisted-pair were in the wire bonding method sometimes used for coaxial cable, the method can make it smaller, lighter, cheaper.
在双绞线中黏合导线的方法有时也用于同轴电缆，这种方法能使其更小、更轻、更便宜。 - Finally, wire bonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。 - Effect Factors Analysis of Wire Bonding Quality on Microwave Circuit
微波电路引线键合质量的影响因素分析 - Thermal-structural analysis was performed for ultrasonic wire bonding ( UWB) by three dimensional finite element method ( FEM).
用三维有限元方法对超声波线焊进行了瞬态的热-结构分析。 - The methods of3D interconnection can be classified into the wire bonding, flip chip, through silicon via ( TSV) and film wire technology, whose advantages and disadvantages are analyzed.
将实现3D互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。 - Many factors would affect wire bonding process.
引线键合过程中有很多因素会对键合质量产生影响。 - After reviewing current wire bonding technology, wire bonding technology development trends are discussed.
在回顾现有的引线键合技术之后，文章主要探讨了集成电路封装中引线键合技术的发展趋势。 - The paper takes the IC-encapsulation equipment& semi-automatic ultrasonic wire bonding machine as the control object.
论文正是以IC封装设备&半自动超声波焊线机为控制对象。 - Wire bonding is still the most popular interconnect technology in the first-level packaging.
一级封装中最流行的互连技术仍为丝焊。 - This study is intended to evaluate the bondability and reliability of single crystal copper wire bonding.
本研究的目的在于评价单晶铜丝在引线键合过程中的可键合性和键合的可靠性。 - Ribbon wire bonding is different from conventional wire bonding technology.
引线带楔焊键合和引线（圆形）楔焊键合是不同的。 - Now, wire bonding has been the most popular interconnection technique in semiconductor device packaging.
目前，引线键合技术已经成为半导体封装中广泛应用的互连方法。 - With the development of the integrated circuit industry, the welding speed and welding line quality of the wire bonding machine appear new demands and challenges.
随着集成电路行业的发展，对引线键合机的焊线速度和质量提出了新的要求和挑战。 - Detailed study of the device wire bonding process on the damage and failure mechanism of the device.
详细研究了器件焊线（键合）过程对器件的损伤及其失效机理。 - In addition, the optimum wire bonding of several of the electrode material had been discussed.
另外，探讨了几种电极材料的引线键合的最佳工艺。 - The parameters of FAB ( free air ball) process during copper wire bonding were optimized.
对铜丝球键合焊形球过程FAB参数进行了优化。